Assembly with at least one antenna and a thermal insulation component

ABSTRACT

Some embodiments of the present disclosure relate to an assembly. In some embodiments the assembly comprises at least one antenna and a thermal insulation component. In some embodiments, the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz. In some embodiments, the thermal insulation component is disposed within the field of RF communication. In some embodiments, the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.

FIELD

The present disclosure relates to the field of thermal insulation for anassembly that includes at least one antenna.

BACKGROUND

[2] The 5th generation wireless technology, 5G, is facing many technicalchallenges in implementation. The challenges may specifically arise athigher frequency bandwidths. At certain high frequencies, including butnot limited to those operating in the millimeter wave regime, radiofrequencies may become susceptible to signal interruption. At the sametime, touch and temperature guidelines (e.g., the UL62368-1 standard)may limit the surface temperature of a 5G wireless device to protectusers from excessive heat generation from a 5G antenna on the wirelessdevice. Assemblies that include materials that not only minimize signalinterruption, but also control the surface temperature of a 5G wirelessdevice are needed.

SUMMARY

Some embodiments of the present disclosure relate to an assemblycomprising:

at least one antenna,

-   -   wherein the at least one antenna is configured to transmit a        field of radiofrequency (RF) communication at an operating        frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

-   -   wherein the thermal insulation component is disposed within the        field of RF communication, and    -   wherein the thermal insulation component has a thermal        conductivity of 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.

Some embodiments of the present disclosure relate to a method of usingan assembly, the method comprising:

obtaining the assembly, wherein the assembly comprises:

-   -   at least one antenna; and    -   a thermal insulation component,        -   wherein the thermal insulation component is disposed within            the field of RF communication, and        -   wherein the thermal insulation component has a thermal            conductivity of 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1            atm;    -   transmitting a field of a radiofrequency (RF) communication from        the at least one antenna at an operating frequency ranging from        6 GHz to 100 GHz, wherein the field of RF communication is        transmitted such that the thermal insulation component is        disposed in the field of RF communication.

Some embodiments of the present disclosure relate to a method of makingan assembly, the method comprising:

obtaining at least one antenna;

-   -   wherein the at least one antenna of is configured to transmit a        field of radiofrequency (RF) communication at an operating        frequency ranging from 6 GHz to 100 GHz; and

placing a thermal insulation component on at least one surface of the atleast one antenna, so as to form an assembly;

-   -   wherein placing the thermal insulation component on at least one        surface of the antenna array disposes the thermal insulation        component within the field of RF communication, and    -   wherein the thermal insulation component has a thermal        conductivity of 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.

Some embodiments of the present disclosure relate to an assemblycomprising:

at least one antenna,

-   -   wherein the at least one antenna is configured to transmit a        field of radiofrequency (RF) communication at an operating        frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

-   -   wherein the thermal insulation component is disposed within the        field of RF communication, and    -   wherein the thermal insulation component has a thermal        conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C.        and 1 atm,    -   wherein the thermal insulation component has a has a dielectric        constant ranging from 1.05 to 4 measured in accordance with IEC        61189-2-721 Edition 1 2015-04 at 10 GHz using a Split Post        Dielectric Resonator (SPDR), and    -   wherein the thermal insulation component has a loss tangent        ranging from 0.00001 to 0.1 measured in accordance with IEC        61189-2-721 Edition 1 2015-04 at 10 GHz using the SPDR.

Some embodiments of the present disclosure relate to an assemblycomprising:

at least one antenna,

-   -   wherein the at least one antenna is configured to transmit a        field of radiofrequency (RF) communication at an operating        frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

-   -   wherein the thermal insulation component is disposed within the        field of RF communication,    -   wherein the thermal insulation component has a thickness of 0.03        mm to 2 mm, and    -   wherein the thermal insulation component comprises an aerogel in        an amount of 30 wt % to 95 wt % based on a total weight of the        thermal insulation component.

Some embodiments of the present disclosure relate to an assemblycomprising:

an antenna array,

-   -   wherein the antenna array is configured to transmit a field of        radiofrequency (RF) communication at an operating frequency        ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

-   -   wherein the thermal insulation component is disposed within the        field of RF communication, and    -   wherein the thermal insulation component comprises:        -   a protective film;        -   at least one thermal insulation layer,            -   wherein the at least one thermal insulation layer is                disposed between the protective film and the at least                one adhesive layer;            -   wherein the at least one thermal insulation layer                defines 50% to 99% of a total thickness of the thermal                insulation component;        -   at least one adhesive layer,            -   wherein the at least one adhesive layer is disposed                between the antenna array and the thermal insulation                layer of the thermal insulation component.

Covered embodiments are defined by the claims, not the above summary.The above summary is a high-level overview of various aspects andintroduces some of the concepts that are further described in theDetailed Description section below. This summary is not intended toidentify key or essential features of the claimed subject matter, nor isit intended to be used in isolation to determine the scope of theclaimed subject matter. The subject matter should be understood byreference to appropriate portions of the entire specification, any orall drawings, and each claim.

DRAWINGS

FIG. 1 depicts a non-limiting example of an array according to thepresent disclosure.

FIG. 2 depicts a non-limiting example of a thermal insulation componentdisposed within a field of radiofrequency (RF) communication.

FIGS. 3A to 3J are non-limiting examples of thermal insulationcomponents according to the present disclosure.

FIG. 4 is a non-limiting example of a location where an operatingtemperature of an assembly may be measured.

FIGS. 5A to 5K are non-limiting examples of assemblies according to thepresent disclosure.

FIGS. 6A and 6B depict a non-limiting example of an assembly having athermal insulation component embedded into an antenna array.

FIG. 7 depicts a non-limiting example of an assembly within anenclosure.

FIG. 8 is a non-limiting example of a model for calculating thermalconductivity.

FIG. 9 is a non-limiting example of a model for calculating RFtransmission characteristics.

FIGS. 10A to 10D illustrate exemplary design spaces for somenon-limiting assemblies of the present disclosure.

FIGS. 11A to 11B illustrate additional exemplary design spaces for somenon-limiting assemblies of the present disclosure.

Some embodiments of the disclosure are herein described, by way ofexample only, with reference to the accompanying drawings. With specificreference now to the drawings in detail, it is stressed that theembodiments shown are by way of example and for purposes of illustrativediscussion of embodiments of the disclosure. In this regard, thedescription taken with the drawings makes apparent to those skilled inthe art how embodiments of the disclosure may be practiced.

DETAILED DESCRIPTION

As used herein “an antenna” is any device configured to transmit a fieldof radiofrequency (RF) communication.

As used herein, “thermal conductivity” is a measure of a material'sability to conduct heat. “Thermal conductivity” can be calculated usingFourier's law. In some non-limiting embodiments, thermal conductivity ofa component comprising multiple layers (such as but not limited to athermal insulation component described herein) can also be calculatedusing the following equation:

${k_{eq} = \frac{t_{eq}}{\frac{t_{1}}{k_{1}} + \frac{t_{2}}{k_{2}} + {\ldots\mspace{11mu}\frac{t_{n}}{k_{n}}}}};$

where k_(eq) is the thermal conductivity of the multi-layered component,where t_(eq) is a total thickness of the component, where t₁, t₂, . . .t_(n) are respective thicknesses of each individual layer, and where,k₁, k₂, . . . k_(n) are respective thermal conductivities of eachindividual layer.

As used herein, a “thermal insulation component” is any component of anassembly described herein that has a thermal conductivity disclosedherein (such, as but not limited to, a thermal conductivity of less than0.025 W/m·K at 25° C. and 1 atm).

As used herein a “thermal insulation layer” is a layer of a thermalinsulation component described herein that has a thermal conductivitydisclosed herein (such, as but not limited to, a thermal conductivity ofless than 0.025 W/m·K at 25° C. and 1 atm).

As used herein “an aerogel” is a solid material comprising at least onegas (e.g., air) as a dispersed interstitial medium within a structural(e.g., microstructural) framework of the solid material.

As used herein a “reinforced aerogel” is an aerogel that comprises atleast one reinforcement material. Several non-limiting examples ofreinforced aerogels and reinforcement materials are disclosed herein,infra.

As used herein, “dielectric constant” is a dimensionless quantity thatmeasures the permittivity of a given material. In some embodiments,“dielectric constant” can be calculated as a ratio of a measuredpermittivity (i.e., due to passage of an electromagnetic wave throughgiven material) over a reference permittivity (i.e., due to the passageof the same electromagnetic wave through a reference material such as avacuum). As used herein, dielectric constant is measured in accordancewith IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a Split PostDielectric Resonator (SPDR). A non-limiting procedure for measuringdielectric constant is provided herein in the “Examples” section, infra.

As used herein, “loss tangent” is a dimensionless quantity that measuresthe ability of a given material to dissipate or “lose” electromagneticenergy (e.g. in the form of heat, frictional losses, and static losses).As used herein, loss tangent is measured in accordance with IEC61189-2-721 Edition 1 2015-04 at 10 GHz using a Split Post DielectricResonator (SPDR). A non-limiting procedure for measuring loss tangent isprovided herein in the “Examples” section, infra.

As used herein, the term “bonded” refers to any mechanism by which aplurality of materials is attached together. Examples of suitablebonding mechanisms include, but are not limited to, heat bonding, laserbonding, mechanical attachment, at least one adhesive, or anycombination thereof.

As used herein the term “clad” refers to a configuration of a structurewherein dissimilar components (e.g., a membrane and an aerogel) of thestructure are bonded together.

Some embodiments of the present disclosure relate to an assembly. Insome embodiments the assembly comprises at least one antenna and athermal insulation component.

Regarding the at least one antenna, in some embodiments, the at leastone antenna is configured to transmit a field of radiofrequency (RF)communication at an operating frequency ranging from 6 GHz to 100 GHz.In some embodiments, the at least one antenna is configured to transmita field of RF communication at an operating frequency ranging from 10GHz to 100 GHz. In some embodiments, the at least one antenna isconfigured to transmit a field of RF communication at an operatingfrequency ranging from 20 GHz to 100 GHz. In some embodiments, the atleast one antenna is configured to transmit a field of RF communicationat an operating frequency ranging from 30 GHz to 100 GHz. In someembodiments, the at least one antenna is configured to transmit a fieldof RF communication at an operating frequency ranging from 40 GHz to 100GHz. In some embodiments, the at least one antenna is configured totransmit a field of RF communication at an operating frequency rangingfrom 50 GHz to 100 GHz. In some embodiments, the at least one antenna isconfigured to transmit a field of RF communication at an operatingfrequency ranging from 60 GHz to 100 GHz. In some embodiments, the atleast one antenna is configured to transmit a field of RF communicationat an operating frequency ranging from 70 GHz to 100 GHz. In someembodiments, the at least one antenna is configured to transmit a fieldof RF communication at an operating frequency ranging from 80 GHz to 100GHz. In some embodiments, the at least one antenna is configured totransmit a field of RF communication at an operating frequency rangingfrom 90 GHz to 100 GHz.

In some embodiments, the at least one antenna is configured to transmita field of RF communication at an operating frequency ranging from 6 GHzto 90 GHz. In some embodiments, the at least one antenna is configuredto transmit a field of RF communication at an operating frequencyranging from 6 GHz to 80 GHz. In some embodiments, the at least oneantenna is configured to transmit a field of RF communication at anoperating frequency ranging from 6 GHz to 70 GHz. In some embodiments,the at least one antenna is configured to transmit a field of RFcommunication at an operating frequency ranging from 6 GHz to 60 GHz. Insome embodiments, the at least one antenna is configured to transmit afield of RF communication at an operating frequency ranging from 6 GHzto 50 GHz. In some embodiments, the at least one antenna is configuredto transmit a field of RF communication at an operating frequencyranging from 6 GHz to 40 GHz. In some embodiments, the at least oneantenna is configured to transmit a field of RF communication at anoperating frequency ranging from 6 GHz to 30 GHz. In some embodiments,the at least one antenna is configured to transmit a field of RFcommunication at an operating frequency ranging from 6 GHz to 20 GHz. Insome embodiments, the at least one antenna is configured to transmit afield of RF communication at an operating frequency ranging from 6 GHzto 10 GHz.

In some embodiments, the at least one antenna is configured to transmita field of RF communication at an operating frequency ranging from 10GHz to 90 GHz. In some embodiments, the at least one antenna isconfigured to transmit a field of RF communication at an operatingfrequency ranging from 20 GHz to 80 GHz. In some embodiments, the atleast one antenna is configured to transmit a field of RF communicationat an operating frequency ranging from 30 GHz to 70 GHz. In someembodiments, the at least one antenna is configured to transmit a fieldof RF communication at an operating frequency ranging from 40 GHz to 60GHz.

In some embodiments, the at least one antenna is configured to transmita field of radiofrequency (RF) communication at a wavelength rangingfrom 3 mm to 50 mm. In some embodiments, the at least one antenna isconfigured to transmit a field of RF communication at a wavelengthranging from 10 mm to 50 mm. In some embodiments, the at least oneantenna is configured to transmit a field of RF communication at awavelength ranging from 20 mm to 50 mm. In some embodiments, the atleast one antenna is configured to transmit a field of RF communicationat a wavelength ranging from 30 mm to 50 mm. In some embodiments, the atleast one antenna is configured to transmit a field of RF communicationat a wavelength ranging from 40 mm to 50 mm.

In some embodiments, the at least one antenna is configured to transmita field of RF communication at a wavelength ranging from 3 mm to 40 mm.In some embodiments, the at least one antenna is configured to transmita field of RF communication at a wavelength ranging from 3 mm to 30 mm.In some embodiments, the at least one antenna is configured to transmita field of RF communication at a wavelength ranging from 3 mm to 20 mm.In some embodiments, the at least one antenna is configured to transmita field of RF communication at a wavelength ranging from 3 mm to 10 mm.

In some embodiments, the at least one antenna is configured to transmita field of RF communication at a wavelength ranging from 10 mm to 40 mm.In some embodiments, the at least one antenna is configured to transmita field of RF communication at a wavelength ranging from 20 mm to 30 mm.

In some embodiments, the at least one antenna may be in the form of anantenna array. In some embodiments, the antenna array is configured totransmit a field of RF communication at any operating frequencydisclosed herein, any wavelength disclosed herein, or any combinationthereof. In some embodiments, the antenna array may comprise a pluralityof antennas. In some embodiments, each antenna of the plurality ofantennas is configured to transmit a field of RF communication at anyoperating frequency disclosed herein, any wavelength disclosed herein,or any combination thereof.

In some embodiments, the antenna array comprises a plurality of planes,for example, by having the form of a shape that has a plurality ofplanes. Without being limiting, the antenna array could take the form ofa cube, a triangular prism, a rectangular prism, or any polyhedron.

A non-limiting example an antenna array is shown in FIG. 1. As shown,exemplary antenna array 100 may comprise a plurality of antennas 101. Insome non-limiting embodiments, antenna array 100 may be shaped as arectangular prism having a plurality of planes 102.

In some embodiments, the antenna array may comprise at least 2 antennas.In some embodiments, the antenna array may comprise at least 3 antennas.In some embodiments, the antenna array may comprise at least 4 antennas.In some embodiments, the antenna array may comprise at least 5 antennas.In some embodiments, the antenna array may comprise at least 10antennas. In some embodiments, the antenna array may comprise at least16 antennas. In some embodiments, the antenna array may comprise atleast 25 antennas. In some embodiments, the antenna array may compriseat least 50 antennas. In some embodiments, the antenna array maycomprise at least 75 antennas. In some embodiments, the antenna arraymay comprise at least 100 antennas.

In some embodiments, the antenna array may comprise 2 to 100 antennas.In some embodiments, the antenna array may comprise 3 to 100 antennas.In some embodiments, the antenna array may comprise 4 to 100 antennas.In some embodiments, the antenna array may comprise 5 to 100 antennas.In some embodiments, the antenna array may comprise 10 to 100 antennas.In some embodiments, the antenna array may comprise 16 to 100 antennas.In some embodiments, the antenna array may comprise 25 to 100 antennas.In some embodiments, the antenna array may comprise 50 to 100 antennas.In some embodiments, the antenna array may comprise 75 to 100 antennas.

In some embodiments, the antenna array may comprise 2 to 75 antennas. Insome embodiments, the antenna array may comprise 2 to 50 antennas. Insome embodiments, the antenna array may comprise 2 to 25 antennas. Insome embodiments, the antenna array may comprise 2 to 16 antennas. Insome embodiments, the antenna array may comprise 2 to 10 antennas. Insome embodiments, the antenna array may comprise 2 to 5 antennas. Insome embodiments, the antenna array may comprise 2 to 4 antennas. Insome embodiments, the antenna array may comprise 2 to 3 antennas.

In some embodiments, the antenna array may comprise 3 to 75 antennas. Insome embodiments, the antenna array may comprise 4 to 50 antennas. Insome embodiments, the antenna array may comprise 5 to 25 antennas. Insome embodiments, the antenna array may comprise 10 to 16 antennas.

In some embodiments, the antenna array comprises 4 to 8 planes. In someembodiments, the antenna array comprises 5 to 8 planes. In someembodiments, the antenna array comprises 6 to 8 planes. In someembodiments, the antenna array comprises 7 to 8 planes.

In some embodiments, the antenna array comprises 4 to 7 planes. In someembodiments, the antenna array comprises 4 to 6 planes. In someembodiments, the antenna array comprises 4 to 5 planes.

In some embodiments, the antenna array comprises 5 to 7 planes. In someembodiments, the antenna array comprises 5 to 6 planes.

Moving on to the thermal insulation component, in some embodiments, thethermal insulation component may be disposed within the field of RFcommunication generated by the at least one antenna. A non-limitingexample of an assembly where the thermal insulation component isdisposed within the field of RF communication is shown in FIG. 2. Asshown, assembly 200 may include a thermal insulation component 202,which may be disposed within a field (1) of RF communication generatedby at least one antenna 201.

In some embodiments, a portion of the thermal insulation componentextends beyond the field of RF communication. In some embodiments, 10%of the thermal insulation component extends beyond the field of RFcommunication. In some embodiments, 20% of the thermal insulationcomponent extends beyond the field of RF communication. In someembodiments, 30% of the thermal insulation component extends beyond thefield of RF communication. In some embodiments, 40% of the thermalinsulation component extends beyond the field of RF communication. Insome embodiments, 50% of the thermal insulation component extends beyondthe field of RF communication. In some embodiments, 60% of the thermalinsulation component extends beyond the field of RF communication. Insome embodiments, 70% of the thermal insulation component extends beyondthe field of RF communication. In some embodiments, 80% of the thermalinsulation component extends beyond the field of RF communication. Insome embodiments, 90% of the thermal insulation component extends beyondthe field of RF communication.

In some embodiments, the thermal insulation component comprises athermal insulation layer. In some embodiments, the thermal insulationcomponent consists of the thermal insulation layer. In some embodiments,the thermal insulation component is embedded into the antenna array.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a thermal conductivityof less than 0.025 W/m·K at 25° C. and 1 atm. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof has a thermal conductivity of less than 0.02 W/m·Kat 25° C. and 1 atm. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof hasa thermal conductivity of less than 0.01 W/m·K at 25° C. and 1 atm. Insome embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a thermal conductivityof less than 0.005 W/m·K at 25° C. and 1 atm. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof has a thermal conductivity of less than 0.0025 W/m·Kat 25° C. and 1 atm.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a thermal conductivityranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a thermal conductivity rangingfrom 0.005 W/m·K to 0.025 W/m·K at 25° C. and 1 atm. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a thermal conductivity rangingfrom 0.01 W/m·K to 0.025 W/m·K at 25° C. and 1 atm. In some embodiments,the thermal insulation component, the thermal insulation layer, or anycombination thereof has a thermal conductivity ranging from 0.02 W/m·Kto 0.025 W/m·K at 25° C. and 1 atm.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a thermal conductivityranging from 0.0025 W/m·K to 0.02 W/m·K at 25° C. and 1 atm. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a thermal conductivity rangingfrom 0.0025 W/m·K to 0.01 W/m·K at 25° C. and 1 atm. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a thermal conductivity rangingfrom 0.0025 W/m·K to 0.005 W/m·K at 25° C. and 1 atm.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a thermal conductivityranging from 0.005 W/m·K to 0.02 W/m·K at 25° C. and 1 atm. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a thermal conductivity rangingfrom 0.005 W/m·K to 0.01 W/m·K at 25° C. and 1 atm. In some embodiments,the thermal insulation component, the thermal insulation layer, or anycombination thereof has a thermal conductivity ranging from 0.01 W/m·Kto 0.02 W/m·K at 25° C. and 1 atm.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a dielectric constantranging from 1.05 to 4 measured in accordance with IEC 61189-2-721Edition 1 2015-04 at 10 GHz using a Split Post Dielectric Resonator(SPDR). In some embodiments, the thermal insulation component, thethermal insulation layer, or any combination thereof has a dielectricconstant ranging from 1.5 to 4 measured in accordance with IEC61189-2-721 Edition 1 2015-04 at 10 GHz using a SPDR. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a dielectric constant ranging from2 to 4 measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at10 GHz using a SPDR. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof hasa dielectric constant ranging from 2.5 to 4 measured in accordance withIEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a SPDR. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a dielectric constant ranging from3 to 4 measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at10 GHz using a SPDR. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof hasa dielectric constant ranging from 3.5 to 4 measured in accordance withIEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a dielectric constantranging from 1.05 to 3.5 measured in accordance with IEC 61189-2-721Edition 1 2015-04 at 10 GHz using a SPDR. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof has a dielectric constant ranging from 1.05 to 3measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHzusing a SPDR. In some embodiments, the thermal insulation component, thethermal insulation layer, or any combination thereof has a dielectricconstant ranging from 1.05 to 2.5 measured in accordance with IEC61189-2-721 Edition 1 2015-04 at 10 GHz using a SPDR. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof has a dielectric constant ranging from1.05 to 2 measured in accordance with IEC 61189-2-721 Edition 1 2015-04at 10 GHz using a SPDR. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof hasa dielectric constant ranging from 1.05 to 1.5 measured in accordancewith IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a dielectric constantranging from 1.1 to 4 measured in accordance with IEC 61189-2-721Edition 1 2015-04 at 10 GHz using a SPDR. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof has a dielectric constant ranging from 1.2 to 4measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHzusing a SPDR. In some embodiments, the thermal insulation component, thethermal insulation layer, or any combination thereof has a dielectricconstant ranging from 1.1 to 1.5 measured in accordance with IEC61189-2-721 Edition 1 2015-04 at 10 GHz using a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a dielectric constantranging from 1.5 to 3.5 measured in accordance with IEC 61189-2-721Edition 1 2015-04 at 10 GHz using a SPDR. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof has a dielectric constant ranging from 2 to 2.5measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHzusing a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.00001 to 0.1 measured in accordance with IEC 61189-2-721 Edition1 2015-04 at 10 GHz using a SPDR. In some embodiments, the thermalinsulation component, the thermal insulation layer, or any combinationthereof has a loss tangent ranging from 0.0001 to 0.1 measured inaccordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using aSPDR. In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.001 to 0.1 measured in accordance with IEC 61189-2-721 Edition 12015-04 at 10 GHz using a SPDR. In some embodiments, the thermalinsulation component, the thermal insulation layer, or any combinationthereof has a loss tangent ranging from 0.01 to 0.1 measured inaccordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using aSPDR. In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.05 to 0.1 measured in accordance with IEC 61189-2-721 Edition 12015-04 at 10 GHz using a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.00001 to 0.05 measured in accordance with IEC 61189-2-721 Edition1 2015-04 at 10 GHz using a SPDR. In some embodiments, the thermalinsulation component, the thermal insulation layer, or any combinationthereof has a loss tangent ranging from 0.00001 to 0.01 measured inaccordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using aSPDR. In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.00001 to 0.001 measured in accordance with IEC 61189-2-721Edition 1 2015-04 at 10 GHz using a SPDR. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof has a loss tangent ranging from 0.00001 to 0.0001measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHzusing a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.0001 to 0.05 measured in accordance with IEC 61189-2-721 Edition1 2015-04 at 10 GHz using a SPDR. In some embodiments, the thermalinsulation component, the thermal insulation layer, or any combinationthereof has a loss tangent ranging from 0.001 to 0.01 measured inaccordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using aSPDR. In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof has a loss tangent rangingfrom 0.005 to 0.1 measured in accordance with IEC 61189-2-721 Edition 12015-04 at 10 GHz using a SPDR.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof, attenuates a transmittedRF signal by less than 1 dB measured relative to air. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof, attenuates a transmitted RF signal byless than 0.75 dB measured relative to air. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof, attenuates a transmitted RF signal by less than 0.5dB measured relative to air. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof,attenuates a transmitted RF signal by less than 0.25 dB measuredrelative to air.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof, attenuates a transmittedRF signal by 0.001 dB to 1 dB measured relative to air. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof, attenuates a transmitted RF signal by0.01 dB to 1 dB measured relative to air. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof, attenuates a transmitted RF signal by 0.1 dB to 1dB measured relative to air. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof,attenuates a transmitted RF signal by 0.25 dB to 1 dB measured relativeto air. In some embodiments, the thermal insulation component, thethermal insulation layer, or any combination thereof, attenuates atransmitted RF signal by 0.5 dB to 1 dB measured relative to air. Insome embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof, attenuates a transmittedRF signal by 0.75 dB to 1 dB measured relative to air.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof, attenuates a transmittedRF signal by 0.001 dB to 0.75 dB measured relative to air. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof, attenuates a transmitted RF signal by0.001 dB to 0.5 dB measured relative to air. In some embodiments, thethermal insulation component, the thermal insulation layer, or anycombination thereof, attenuates a transmitted RF signal by 0.001 dB to0.25 dB measured relative to air. In some embodiments, the thermalinsulation component, the thermal insulation layer, or any combinationthereof, attenuates a transmitted RF signal by 0.001 dB to 0.1 dBmeasured relative to air. In some embodiments, the thermal insulationcomponent, the thermal insulation layer, or any combination thereof,attenuates a transmitted RF signal by 0.001 dB to 0.01 dB measuredrelative to air.

In some embodiments, the thermal insulation component, the thermalinsulation layer, or any combination thereof, attenuates a transmittedRF signal by 0.01 dB to 0.75 dB measured relative to air. In someembodiments, the thermal insulation component, the thermal insulationlayer, or any combination thereof, attenuates a transmitted RF signal by0.1 dB to 0.5 dB measured relative to air.

In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises an aerogel.In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 30 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 40 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 50 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 60 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 70 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 80 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 90 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof. In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of at least 95 wt % based on a total weight of the thermalinsulation layer, the thermal insulation component, or any combinationthereof.

In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of 30 wt % to 95 wt % based on a total weight of thethermal insulation layer, the thermal insulation component, or anycombination thereof. In some embodiments, the thermal insulation layer,the thermal insulation component, or any combination thereof comprisesthe aerogel in an amount of 40 wt % to 95 wt % based on a total weightof the thermal insulation layer, the thermal insulation component, orany combination thereof. In some embodiments, the thermal insulationlayer, the thermal insulation component, or any combination thereofcomprises the aerogel in an amount of 50 wt % to 95 wt % based on atotal weight of the thermal insulation layer, the thermal insulationcomponent, or any combination thereof. In some embodiments, the thermalinsulation layer, the thermal insulation component, or any combinationthereof comprises the aerogel in an amount of 60 wt % to 95 wt % basedon a total weight of the thermal insulation layer, the thermalinsulation component, or any combination thereof. In some embodiments,the thermal insulation layer, the thermal insulation component, or anycombination thereof comprises the aerogel in an amount of 70 wt % to 95wt % based on a total weight of the thermal insulation layer, thethermal insulation component, or any combination thereof. In someembodiments, the thermal insulation layer, the thermal insulationcomponent, or any combination thereof comprises the aerogel in an amountof 80 wt % to 95 wt % based on a total weight of the thermal insulationlayer, the thermal insulation component, or any combination thereof. Insome embodiments, the thermal insulation layer, the thermal insulationcomponent, or any combination thereof comprises the aerogel in an amountof 90 wt % to 95 wt % based on a total weight of the thermal insulationlayer, the thermal insulation component, or any combination thereof.

In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of 30 wt % to 90 wt % based on a total weight of thethermal insulation layer, the thermal insulation component, or anycombination thereof. In some embodiments, the thermal insulation layer,the thermal insulation component, or any combination thereof comprisesthe aerogel in an amount of 30 wt % to 80 wt % based on a total weightof the thermal insulation layer, the thermal insulation component, orany combination thereof. In some embodiments, the thermal insulationlayer, the thermal insulation component, or any combination thereofcomprises the aerogel in an amount of 30 wt % to 70 wt % based on atotal weight of the thermal insulation layer, the thermal insulationcomponent, or any combination thereof. In some embodiments, the thermalinsulation layer, the thermal insulation component, or any combinationthereof comprises the aerogel in an amount of 30 wt % to 60 wt % basedon a total weight of the thermal insulation layer, the thermalinsulation component, or any combination thereof. In some embodiments,the thermal insulation layer, the thermal insulation component, or anycombination thereof comprises the aerogel in an amount of 30 wt % to 50wt % based on a total weight of the thermal insulation layer, thethermal insulation component, or any combination thereof. In someembodiments, the thermal insulation layer, the thermal insulationcomponent, or any combination thereof comprises the aerogel in an amountof 30 wt % to 40 wt % based on a total weight of the thermal insulationlayer, the thermal insulation component, or any combination thereof.

In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof comprises the aerogelin an amount of 40 wt % to 90 wt % based on a total weight of thethermal insulation layer, the thermal insulation component, or anycombination thereof. In some embodiments, the thermal insulation layer,the thermal insulation component, or any combination thereof comprisesthe aerogel in an amount of 50 wt % to 80 wt % based on a total weightof the thermal insulation layer, the thermal insulation component, orany combination thereof. In some embodiments, the thermal insulationlayer, the thermal insulation component, or any combination thereofcomprises the aerogel in an amount of 60 wt % to 70 wt % based on atotal weight of the thermal insulation layer, the thermal insulationcomponent, or any combination thereof.

In some embodiments, the thermal insulation component has a thickness of0.03 mm to 2 mm. In some embodiments, the thermal insulation componenthas a thickness of 0.05 mm to 2 mm. In some embodiments, the thermalinsulation component has a thickness of 0.1 mm to 2 mm. In someembodiments, the thermal insulation component has a thickness of 0.5 mmto 2 mm. In some embodiments, the thermal insulation component has athickness of 1 mm to 2 mm. In some embodiments, the thermal insulationcomponent has a thickness of 1.5 mm to 2 mm.

In some embodiments, the thermal insulation component has a thickness of0.03 mm to 1.5 mm. In some embodiments, the thermal insulation componenthas a thickness of 0.03 mm to 1 mm. In some embodiments, the thermalinsulation component has a thickness of 0.03 mm to 0.5 mm. In someembodiments, the thermal insulation component has a thickness of 0.03 mmto 0.1 mm. In some embodiments, the thermal insulation component has athickness of 0.03 mm to 0.05 mm.

In some embodiments, the thermal insulation component has a thickness of0.05 mm to 1.5 mm. In some embodiments, the thermal insulation componenthas a thickness of 0.1 mm to 1 mm.

In some embodiments, the thermal insulation layer comprises an aerogel.In some embodiments, the aerogel is a ceramic aerogel, a polymeraerogel, or any combination thereof.

In some embodiments, the ceramic aerogel is a silica aerogel.

In some embodiments, the polymer aerogel is rendered hydrophobic. Insome embodiments, hydrophobic treatment of the polymer aerogel minimizesabsorption of water, adsorption of water, or any combination thereof, soas to reduce water's adverse effect on RF transmission. In someembodiments, the polymer aerogel is treated with 2, 2-Bis[4-(4-aminophenoxy) phenyl] propane (“BAPP”) to render the polymeraerogel hydrophobic. In some embodiments, the polymer aerogel isrendered hydrophobic through at least one treatment described in ChinesePatent Application Publication No. CN109734954A to Hu et al, which isincorporated by reference herein in its entirety.

In some embodiments, the polymer aerogel is a polyimide aerogel. In someembodiments, the polymer aerogel is a polyamide aerogel.

In some embodiments, the aerogel is a reinforced aerogel. In someembodiments, the reinforced aerogel is a polymer reinforced aerogel. Insome embodiments, the polymer reinforced aerogel is a silica aerogelcomprising at least one polymer as a reinforcement material. In someembodiments, the polymer reinforced aerogel is a polyimide aerogelcomprising at least one polymer as a reinforcement material.

In some embodiments, the polymer reinforced aerogel is a polyethyleneterephthalate (PET) reinforced aerogel. In some embodiments, the PETreinforced aerogel is a silica aerogel comprising PET as a reinforcementmaterial. In some embodiments, the PET reinforced aerogel is a polyimideaerogel comprising PET as a reinforcement material. In some embodiments,the PET reinforced aerogel can take the form of a PET non-woven textilereinforced aerogel.

In some embodiments, the polymer reinforced aerogel is apolytetrafluoroethylene (PTFE) reinforced aerogel. In some embodiments,the PTFE reinforced aerogel is a silica aerogel comprising PTFE as areinforcement material. A non-limiting example of a silica aerogelcomprising PTFE as a reinforcement material is described in of U.S. Pat.No. 7,118,801 to Ristic-Lehmann et al, which is incorporated byreference herein in entirety. In some embodiments, the PTFE reinforcedaerogel is a polyimide aerogel comprising PTFE as a reinforcementmaterial. In some embodiments, the PTFE reinforced aerogel can take theform of a PTFE membrane reinforced aerogel or a PTFE nanofiber webreinforced aerogel.

In some embodiments, the PTFE reinforced aerogel is a PTFE reinforcedaerogel in a clad configuration, wherein the clad configuration furthercomprises a plurality of expanded polytetrafluoroethylene (ePTFE)layers, wherein each of the plurality of ePTFE layers is bonded to asurface of the PTFE reinforced aerogel.

In some embodiments, the polymer reinforced aerogel comprises a polymerreinforcement material chosen from: ePTFE, polyimide, polyamide,polypropylene, polyvinylidene difluoride (PVDF), polyethylene or anycombination thereof.

In some embodiments, the aerogel is a ceramic reinforced aerogel. Insome embodiments, the ceramic reinforced aerogel comprises fiberglass asa reinforcement material.

In some embodiments, the aerogel is a membrane reinforced aerogel. Insome embodiments the membrane of the membrane reinforced aerogel is anePTFE membrane, a polyethylene membrane, or any combination thereof.

In some embodiments, the aerogel is a nanofiber reinforced aerogel. Insome embodiments, the nanofiber reinforced aerogel is reinforced with apolyimide nanofiber web, a polyamide nanofiber web, a polypropylenenanofiber web, a PVDF nanofiber web, a fiberglass nanofiber web, a PETnanofiber web, or any combination thereof.

In some embodiments, the aerogel is a textile reinforced aerogel. Insome embodiments, the textile reinforced aerogel is a woven textilereinforced aerogel. In some embodiments, the textile reinforced aerogelis a non-woven textile reinforced aerogel. In some embodiments, thetextile aerogel is a cloth reinforced aerogel. In some embodiments, theaerogel is a felt reinforced aerogel.

In some embodiments the woven textile of the woven textile reinforcedaerogel is a PET woven textile, a polypropylene woven textile, apolyamide woven textile, or any combination thereof.

In some embodiments, the non-woven textile of the non-woven textilereinforced aerogel is a polypropylene non-woven textile, a polyamidenon-woven textile, or any combination thereof.

In some embodiments, the cloth reinforced aerogel comprises fiberglasscloth, cotton cloth, or any combination thereof.

In some embodiments, the felt reinforced aerogel comprises fiberglassfelt, cotton felt, or any combination thereof.

In some embodiments, the aerogel is a carrier film reinforced aerogel.In some embodiments, the carrier film is a polypropylene carrier film, aPET carrier film, or any combination thereof.

In some embodiments, the thermal insulation layer, the thermalinsulation component, or any combination thereof, comprises afluoropolymer. In some embodiments, the fluoropolymer is PTFE. In someembodiments, the fluoropolymer is ePTFE.

In some embodiments, the thermal insulation component further comprises,in addition to a thermal insulation layer, a protective film, at leastone adhesive layer, or any combination thereof. In some embodiments, thethermal insulation component comprises a plurality of adhesive layers.In some embodiments, at least one of the plurality of adhesive layersdefines a portion of the protective film. In some embodiments, thethermal insulation component comprises a plurality of thermal insulationlayers. In some embodiments, an adhesive layer is disposed between eachthermal insulation layer. In some embodiments, the thermal insulationcomponent consists of the thermal insulation layer. In some embodiments,the thermal insulation component consists of the thermal insulationlayer and an adhesive layer. In some embodiments, the thermal insulationcomponent consists of the thermal insulation layer and a plurality ofadhesive layers. In some embodiments, the thermal insulation componentconsists of the thermal insulation layer and the protective film.

In some embodiments, the protective film comprises a polymer layer andan adhesive layer. In some embodiments, the protective film consists ofthe polymer layer. In some embodiments, the polymer layer of theprotective film described herein comprises PET. In some embodiments, thepolymer layer of the protective film described herein comprises PTFE. Insome embodiments, the polymer layer of the protective film describedherein comprises ePTFE.

In some embodiments, the polymer layer of the protective film describedherein comprises polyethylene, polyimide, polyamide, polypropylene (suchas but not limited to biaxially-oriented polypropylene “BOPP”), PVDF, orany combination thereof.

In some embodiments, the polymer layer of the protective film describedherein may comprise ultra-high molecular weight polyethylene (UHMWPE),expanded polyethylene (ePE), low-density-polyethylene (LDPE),high-density-polyethylene (HDPE), Ethylene tetrafluoroethylene (ETFE),Fluorinated ethylene propylene (FEP),tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer(THV), glass reinforced epoxy, polystyrene, polyvinyl chloride (PVC),Polyether ether ketone (PEEK), aramid polymers, polymethyl methacrylate(PMMA), or any combination thereof.

In some embodiments, any adhesive layer described herein (e.g., anyadhesive layer of the thermal insulation component, the protective film,or any combination thereof), may comprise an acrylic-based adhesive. Insome embodiments, any adhesive layer described herein (e.g., anyadhesive layer of the thermal insulation component, the protective film,or any combination thereof), may comprise an acrylic-based adhesive anda PET carrier film. In some embodiments, any adhesive layer describedherein (e.g., any adhesive layer of the thermal insulation component,the protective film, or any combination thereof), may comprise asilicone-based adhesive. In some embodiments, any adhesive layerdescribed herein (e.g., any adhesive layer of the thermal insulationcomponent, the protective film, or any combination thereof), maycomprise a thermoset adhesive, a urethane-based adhesive, a rubberadhesive, or any combination thereof. In some embodiments where there isa plurality of adhesive layers, each adhesive layer may be the same. Insome embodiments where there is a plurality of adhesive layers, eachadhesive layer may be different. In some embodiments where there is aplurality of adhesive layers, some adhesive layers may be the same whileothers may be different.

In some embodiments, a combined thickness of the protective film and anyadhesive layer or adhesive layers of the thermal insulation componentdoes not exceed a thickness of the thermal insulation layer. In someembodiments, a combined thickness of the protective film and anyadhesive layer or adhesive layers of the thermal insulation componentdoes not exceed 50% of a thickness of the thermal insulation component.In some embodiments, a combined thickness of the protective film and anyadhesive layer or adhesive layers of the thermal insulation componentdoes not exceed 40% of a thickness of the thermal insulation component.In some embodiments, a combined thickness of the protective film and anyadhesive layer or adhesive layers of the thermal insulation componentdoes not exceed 30% of a thickness of the thermal insulation component.In some embodiments, a combined thickness of the protective film and anyadhesive layer or adhesive layers of the thermal insulation componentdoes not exceed 20% of a thickness of the thermal insulation component.In some embodiments, a combined thickness of the protective film and anyadhesive layer or adhesive layers of the thermal insulation componentdoes not exceed 10% of a thickness of the thermal insulation component.

In some embodiments, the thermal insulation layer defines at least 50%of a total thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines at least 60% of atotal thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines at least 70% of atotal thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines at least 80% of atotal thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines at least 90% of atotal thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines at least 95% of atotal thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines at least 99% of atotal thickness of the thermal insulation component. In someembodiments, the thermal insulation layer defines 100% of a totalthickness of the thermal insulation component.

In some embodiments, the at least one thermal insulation layer defines50% to 99% of a total thickness of the thermal insulation component. Insome embodiments, the at least one thermal insulation layer defines 60%to 99% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 70% to99% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 80% to99% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 90% to99% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 95% to99% of a total thickness of the thermal insulation component.

In some embodiments, the at least one thermal insulation layer defines50% to 95% of a total thickness of the thermal insulation component. Insome embodiments, the at least one thermal insulation layer defines 50%to 90% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 50% to80% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 50% to70% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 50% to60% of a total thickness of the thermal insulation component.

In some embodiments, the at least one thermal insulation layer defines60% to 95% of a total thickness of the thermal insulation component. Insome embodiments, the at least one thermal insulation layer defines 70%to 90% of a total thickness of the thermal insulation component. In someembodiments, the at least one thermal insulation layer defines 75% to85% of a total thickness of the thermal insulation component.

Non-limiting examples of a thermal insulation component according to thepresent disclosure are shown in FIG. 3A to 3J.

As shown in FIG. 3A, thermal insulation component 300 may comprisethermal insulation layer 301. As further illustrated in FIG. 3A, thermalinsulation component 300 may, in some embodiments, comprise a protectivefilm 302. In some embodiments, thermal insulation component 300 mayconsist of thermal insulation layer 301 and protective film 302. Asshown in FIGS. 3A and 3B, in some embodiments, protective film 302 maycomprise polymer layer 303 and adhesive layer 304. As illustrated inFIG. 3A, in some embodiments, adhesive layer 304 of the protective film302 may be disposed between the thermal insulation layer 301 and thepolymer layer 303 of the protective film 302.

As further illustrated in FIG. 3A, in some embodiments, thermalinsulation component 301 also comprises adhesive layer 305, which may bereferred to as a “second adhesive layer” in embodiments that includeadhesive layer 304 as part of the protective film 302. In someembodiments, thermal insulation layer 301 is disposed between theprotective film 302 and adhesive layer 305. In some embodiments, wherethe “second adhesive layer” is present, thermal insulation layer 301 maybe disposed between adhesive layer 304 and second adhesive layer 305 asshown in FIG. 3A. In some embodiments of FIGS. 3A and 3B, adhesive layer305 may be disposed between the thermal insulation layer 301 and the atleast one antenna (not shown).

As shown in FIG. 3C, in some embodiments, the thermal insulationcomponent 300 may consist of thermal insulation layer 301.

As shown in FIG. 3D, in some embodiments, thermal insulation component300 may comprise the thermal insulation layer 301 and adhesive layer305. In some embodiments, thermal insulation component 300 may consistof the thermal insulation layer 301 and the adhesive layer 305. In someembodiments of FIG. 3D, adhesive layer 305 may be disposed between thethermal insulation layer 301 and the at least one antenna (not shown).

An additional non-limiting example of a thermal insulation componentaccording to the present disclosure is shown in FIG. 3E. As shown inFIG. 3E, thermal insulation component 300 may comprise thermalinsulation layer 301 and protective film 302. In some embodiments,protective film 302 may comprise polymer layer 303. In some embodiments,protective film 302 may consist of polymer layer 303. In someembodiments, adhesive layer 305 may be disposed between the thermalinsulation layer 301 and the at least one antenna (not shown). In someembodiments, the adhesive layer 305 may contact protective film 302,polymer layer 303, or any combination thereof at edge seal 306.

An additional non-limiting example of a thermal insulation componentaccording to the present disclosure is shown in FIGS. 3F to 3H.Specifically, FIG. 3F is a top view of a thermal insulation component,FIG. 3G is an isometric exploded view of the thermal insulationcomponent of FIG. 3F, and FIG. 3H is a cross-sectional view of thethermal insulation component of FIGS. 3F and 3G.

As shown in FIGS. 3F to 3H, thermal insulation component 300 may includea structure that includes a plurality of wings 307. As shown in FIGS. 3Gand 3H, in some embodiments, the plurality of wings 307 may be presenton the protective film 302, the adhesive layer 305, or any combinationthereof. In some embodiments, the thermal insulation layer 301 alsocomprises a plurality of wings. In some embodiments, the thermalinsulation layer 301 does not comprise a plurality of wings.

Yet another non-limiting example of a thermal insulation component isshown in FIG. 3I. As shown, thermal insulation component 300 may includeprotective film 302, which may, in some embodiments, also includepolymer layer 302 and first adhesive layer 304. In some embodiments,thermal insulation component 300 may further include a plurality ofthermal insulation layers 301A and 301B and a plurality of secondadhesive layers 305A and 305B. As shown, in some embodiments, at leastone adhesive layer, such as, but not limited to second adhesive layer305A, may be disposed between two insulation layers, such as but notlimited to thermal insulation layers 301A and 301B. In some embodiments,one of the plurality of adhesive layers, such as but not limited toadhesive layer 305B may be bonded to at least one antenna (not shown).In some embodiments, additional thermal insulation layers, e.g., [301C,301D, . . . 301Z . . . ] may be present. In some embodiments, additionalsecond adhesive layers, e.g., [301C, 301D, . . . 301Z . . . ] may bepresent.

A further additional non-limiting example of a thermal insulationcomponent according to the present disclosure is shown in FIG. 3J. Asshown, thermal insulation component 300 may have a clad configuration,where the clad configuration comprises a plurality of ePTFE layers 308,where each of the plurality of ePTFE layers 308 is bonded to a surfaceof the thermal insulation layer 301. As described herein, infra, in someembodiments, the thermal insulation layer 301 may be a PTFE reinforcedlayer, such as but not limited to a PTFE reinforced aerogel. In somenon-limiting examples, the PTFE reinforced aerogel of the thermalinsulation component is in the clad configuration

Turning to the assembly, in some embodiments, the assembly may bedisposed within an enclosure. The enclosure may form a portion of anydevice, such as but not limited to, a mobile device, a cell-phone, alaptop, an augmented reality device, a virtual reality device, aheadset, an automotive radar, or any combination thereof. In someembodiments, the device may be bonded to the enclosure by any suitablebonding mechanism described herein.

In some embodiments, the assembly may further comprise a poweramplifier. In some embodiments, the power amplifier may be in physicalcontact with the assembly. In some embodiments, the power amplifier maybe bonded to the assembly using any suitable bonding mechanism describedherein. In some embodiments, the power amplifier may also be disposedwithin the enclosure.

In some embodiments, an operating temperature of the assembly may bemeasured at an interface between the thermal insulation component andthe at least one antenna. A non-limiting example of an assembly havingan interface at which the operating temperature of the assembly may bemeasured is shown in FIG. 4. As shown, the operating temperature of anassembly 400 may be measured at interface 403 between the thermalinsulation component 401 and the at least one antenna 402.

In some embodiments, the assembly has an operating temperature rangingfrom 20° C. to 120° C. In some embodiments, the assembly has anoperating temperature ranging from 40° C. to 120° C. In someembodiments, the assembly has an operating temperature ranging from 60°C. to 120° C. In some embodiments, the assembly has an operatingtemperature ranging from 80° C. to 120° C. In some embodiments, theassembly has an operating temperature ranging from 100° C. to 120° C.

In some embodiments, the assembly has an operating temperature rangingfrom 20° C. to 100° C. In some embodiments, the assembly has anoperating temperature ranging from 20° C. to 80° C. In some embodiments,the assembly has an operating temperature ranging from 20° C. to 60° C.In some embodiments, the assembly has an operating temperature rangingfrom 20° C. to 40° C.

In some embodiments, the assembly has an operating temperature rangingfrom 40° C. to 100° C. In some embodiments, the assembly has anoperating temperature ranging from 60° C. to 80° C.

A non-limiting example of an exemplary assembly is shown in FIGS. 5A to5C. FIG. 5A is an exploded view of an exemplary assembly. FIG. 5B is acollapsed view of the exemplary assembly of FIG. 5A. FIG. 5C is across-sectional view of the exemplary assembly of FIGS. 5A and 5B.

As shown in FIGS. 5A to 5C, assembly 500 may, in some embodiments,include thermal insulation component 501 and at least one antenna 505.In some embodiments, thermal insulation component 501 may includethermal insulation layer 502, protective film 503, and adhesive layer504.

Another non-limiting example of an exemplary assembly is shown in FIGS.5D to 5G. FIG. 5D is an exploded view of an exemplary assembly withwings 506 unfolded. FIG. 5E is an exploded view of an exemplary assemblywith wings 506 folded. FIG. 5F is a collapsed view of the exemplaryassembly of FIGS. 5D and 5E. FIG. 5G is a cross-sectional view of theexemplary assembly of FIGS. 5D to 5G.

As shown in FIGS. 5D to 5G, assembly 500 may, in some embodiments,include thermal insulation component 501 and at least one antenna 505.In some embodiments, thermal insulation component 501 may includethermal insulation layer 502, protective film 503, and adhesive layer504.

As shown protective film 503, adhesive layer 504, or any combinationthereof, may have a plurality of wings 506. In some embodiments, theplurality of wings 506 may be folded so as to form assembly 500. In someembodiments, such as the embodiment of FIG. 5G, the protective film 503may surround the thermal insulation layer 502.

In some embodiments, the at least one antenna 505 may take the form ofan antenna array having a plurality of planes 507. In some of theseembodiments, such as but not limited to some embodiments of FIG. 5G, thethermal insulation component 501 may be in contact with at least two ofthe plurality of planes 507. This can occur, in one non-limiting exampleof FIGS. 5E and 5G, by folding wings 506 of the protective film 503, theadhesive layer 504, or any combination thereof, around the at least oneantenna 505 (which may take the form of an antenna array), such that thewings 506 of the protective film 503, the adhesive layer 504, or anycombination thereof, contact the plurality of planes 507.

Another non-limiting example of an exemplary assembly is shown in FIGS.5H to 5K. FIG. 5H is an exploded view of an exemplary assembly withwings 506 unfolded. FIG. 5I is an exploded view of an exemplary assemblywith wings 506 folded. FIG. 5J is a collapsed view of the exemplaryassembly of FIGS. 5H and 5I FIG. 5K is a cross-sectional view of theexemplary assembly of FIGS. 5H to 5J.

As shown in FIGS. 5H to 5K, thermal insulation layer 502 of the thermalinsulation component 501 may also include wings 506, which may alsocontact the plurality of planes 507 of at least one antenna 505 (whichmay take the form of an antenna array). Accordingly, in someembodiments, the wings 506 of thermal insulation component 502, theprotective film 503, the adhesive layer 504, or any combination thereof,may contact the plurality of planes 507.

Yet another non-limiting example of an assembly is shown in FIGS. 6A and6B. FIG. 6A depicts a non-limiting example of an antenna array 602 thatincludes antenna patches 603, a plurality of dielectric/copper layers604, and a plurality of copper layers 605. As shown in FIG. 6B, in someembodiments, assembly 600 may include a thermal insulation component601, which may be embedded within the antenna array 602 of FIG. 6A.Moreover, in some embodiments, such as the embodiment of FIG. 6B, thethermal insulation component 601 may be disposed within a field (Φ) ofRF communication generated by antenna array 602. In some embodiments, Φpropagates through antenna array 602 In some embodiments, copper layers605 consist of copper. In some embodiments, antenna patches 603 aredisposed below the thermal insulation component 601.

A further non-limiting example of an assembly is shown in FIG. 7. Asshown, assembly 700 may include thermal insulation component 701 and atleast one antenna 702. In some embodiments, thermal insulation componentmay be bonded to at least one antenna 702 by adhesive layer 704. In someembodiments, assembly 700 may be housed within an enclosure 703. In someembodiments, enclosure 703 defines a part of a device, such as but notlimited to, a mobile device. In some embodiments, assembly 700 may bebonded to the enclosure by a second adhesive layer 705. As shown, insome embodiments, second adhesive layer 704 may be disposed between thethermal insulation component 701 and the at least one antenna.

Some embodiments of the present disclosure relate to a method of usingthe assembly. In some embodiments, the method comprises obtaining theassembly and transmitting a field of RF communication from the at leastone antenna at an operating frequency ranging from 6 GHz to 100 GHz. Insome embodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 10 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 20 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 30 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 40 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 50 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 60 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 70 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 80 GHz to 100 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 90 GHz to 100 GHz.

In some embodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 90 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 80 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 70 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 60 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 50 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 40 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 30 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 20 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 6 GHz to 10 GHz.

In some embodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 10 GHz to 90 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 20 GHz to 80 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 30 GHz to 70 GHz. In someembodiments, the method comprises obtaining the assembly andtransmitting a field of RF communication from the at least one antennaat an operating frequency ranging from 40 GHz to 60 GHz.

Some embodiments of the present disclosure relate to a method of makingthe assembly. In some embodiments, the method comprises obtaining atleast one antenna and placing a thermal insulation component on at leastone surface of the at least one antenna, so as to form the assembly. Insome embodiments, the method comprises forming the thermal insulationcomponent from a thermal insulation layer and a protective film. In someembodiments, the method comprises forming the protective film from apolymer layer and an adhesive layer. In some embodiments, the methodcomprises forming the thermal insulation component by bonding theadhesive layer of the protective film to the thermal insulation layer.In some embodiments, the method comprises forming the thermal insulationcomponent from a thermal insulation layer and an adhesive layer. In someembodiments, the method comprises forming the thermal insulationcomponent from a thermal insulation layer, an adhesive layer, and aprotective film. In some embodiments, the method comprises placing thethermal insulation component on at least one surface of the at least oneantenna. In some embodiments, the method comprises bonding the thermalinsulation component to at least one surface of the at least oneantenna. In some embodiments, the method comprises placing the thermalinsulation component on at least two planes of an antenna arraydescribed herein. In some embodiments, the method comprises placing theassembly in an enclosure (e.g., an enclosure of a mobile device).

Among those benefits and improvements that have been disclosed, otherobjects and advantages of this disclosure will become apparent from thefollowing description taken in conjunction with the accompanyingfigures. Detailed embodiments of the present disclosure are disclosedherein; however, it is to be understood that the disclosed embodimentsare merely illustrative of the disclosure that may be embodied invarious forms. In addition, each of the examples given regarding thevarious embodiments of the disclosure are intended to be illustrative,and not restrictive.

Throughout the specification and claims, the following terms take themeanings explicitly associated herein, unless the context clearlydictates otherwise. The phrases “in one embodiment,” “in an embodiment,”and “in some embodiments” as used herein do not necessarily refer to thesame embodiment(s), though it may. Furthermore, the phrases “in anotherembodiment” and “in some other embodiments” as used herein do notnecessarily refer to a different embodiment, although it may. Allembodiments of the disclosure are intended to be combinable withoutdeparting from the scope or spirit of the disclosure.

As used herein, the term “based on” is not exclusive and allows forbeing based on additional factors not described, unless the contextclearly dictates otherwise. In addition, throughout the specification,the meaning of “a,” “an,” and “the” include plural references. Themeaning of “in” includes “in” and “on.”

As used herein, terms such as “comprising” “including,” and “having” donot limit the scope of a specific claim to the materials or stepsrecited by the claim.

As used herein, the term “consisting essentially of” limits the scope ofa specific claim to the specified materials or steps and those that donot materially affect the basic and novel characteristic orcharacteristics of the specific claim.

EXAMPLES Test Methods

Thermal Conductivity Test Method: Thermal conductivity is measured usinga TA® Instruments FOX50 Heat Flow Meter. This is a steady state methodthat conforms to the ASTM C518 standard. In the FOX50 tester, thethermal conductivity of a material is measured on a two-inch diametersample at 25° C. with the temperature of the hot plate set to 30° C. andthe cold plate set to 20° C. In addition, the sample was measured under6 psi of pressure.

Dielectric Property Test Method: The IEC 61189-2-721 Edition 1 2015-04standard describes the method used to measure the dielectric constantand loss tangent of a material using a Split Post Dielectric Resonator(SPDR). A 10 GHz SPDR measures the dielectric properties of a flat sheetsample with rectangular geometry, 100 mm×60 mm. The samples were notpreconditioned and the thickness was measured using a snap gauge with 1psi of pressure.

Thermogravimetric Analysis Test Method: The thermogravimetric analysis(TGA) data was collected using a TA® Instruments Q5000 IR. 10-20 mg ofsample was placed in a tared platinum sample pan. Samples were analyzedby heating to 100° C. under nitrogen purge gas and holding the sampleisothermally for 20 minutes. The samples were then heated to 800° C. at50° C./minute and held isothermally for 10 minutes. The purge gas wasthen switched to air and the samples were held isothermally for afurther 15 minutes. The weight % aerogel loading is calculated bydividing the residual sample mass at the end of the test by the mass ofthe sample after the initial isothermal hold at 100° C. The initialisothermal hold removes residual water in the sample to get an accuratereading of the initial mass of the sample. The residual sample mass atthe end of the test should be entirely comprised of aerogel, as allother constituents have burned off the sample after the 800° C.isothermal hold.

Example 1

Measured material attributes of exemplary thermal insulation components(“components”) and exemplary constituent layers (e.g., a thermalinsulation layer, at least one adhesive layer, a protective film, apolymer layer, or any combination thereof) were used to model thermaland RF performance of various component designs. Components wereevaluated using the equations described in FIGS. 8 and 9. Designs wereiterated to identify an operable design space for components that wouldmeet the requirements. Material inputs were measured per the ThermalConductivity Test Method and Dielectric Property Test Method. Outputs(Results) were determined using FIGS. 8 and 9.

As shown in FIGS. 8 and 9, the component design space can, in someinstances, be defined by the thermal conductivity (k), dielectricconstant (Dk), and loss tangent (Df) of the constituent layers in thecomponent stack, and can in some embodiments, be defined by a totalcomponent thickness and composition (percentage) by thickness of eachconstituent layer. For example, an acceptable design space for a thermalinsulation component may be based on materials chosen and the finalcomposition.

In the present Example, three example components (two constituent layerseach) were constructed using properties for the thermal insulation layerthat encompass the bounds of currently measured materials. In order tovisually simplify the effects of different parameters on the operabledesign space, properties of the protective film were fixed for allexample components. The thickness of the protective film was not fixedsuch that the protective film could be constructed into variousexemplary designs alongside the thermal insulation layer. FIGS. 10A-Cshow a graph of each component as a function of component thickness inmm (on the y-axis), and % insulation by thickness (on the x-axis). FIG.10D depicts a key. The properties for each graph are displayed in Table1 below.

TABLE 1 Material Properties of Constituent Layers of FIGS. 10A-10CThermal Insulation Layer Protective Film FIG. No. k (W/m · K) Dk Df k(W/m · K) Dk Df 10A 0.015 1.1 0.005 0.2 2.5 0.01 10B 0.018 1.1 0.03 10C0.021 1.8 0.005

In FIGS. 10A-C, all area that is white is considered operable designspace. Area that is grey fails one or multiple of the thermal, RF, andthickness limits described above (and denoted in the key of FIG. 10D).

Referring again to FIG. 8, the thermal conductivity (k) of the componentmay depend on respective conductivities of the constituent componentsand the percentage thickness of each constituent layer in the component.This calculation presents itself as a vertical limit in the graphs sinceit is not dependent on total component thickness. Moving from FIG. 10Ato FIG. 10B to FIG. 10C, an increase in thermal conductivity of thermalinsulation layer moves the thermal limit to the right (increased %insulation by thickness), narrowing the operable component design space.

Referring to FIG. 9, the RF transmission loss of the component, at agiven frequency, may depend on the dielectric constant (Dk), losstangent (Df), and thickness of each constituent layer in the component.Looking at FIG. 10A as the control condition, utilizing lower end valuesof Dk (1.1) and Df (0.005) measured for thermal insulation layers, theoperable design space (for RF limits only) can extend up to the ≥2 mmthickness limit at ≥˜80% insulation by thickness. Moving to FIG. 10B,the Dk was held at 1.1 and the Df was increased to an upper end valuemeasured for thermal insulation layers (0.03). The operable design space(for RF limits only) in FIG. 10B may be minimally narrowed from FIG.10A, extending up to the 2 mm thickness limit at ≥˜90% insulation bythickness. Moving to FIG. 10C, the Df was returned to 0.005 and the Dkwas increased to an upper end value measured for thermal insulationlayers (1.8). As shown, the operable design space (RF limits only) canbe significantly narrowed from FIGS. 10A and 10B, yielding functionalcomponents of ˜0.5 mm thickness at ≥˜85% insulation by thickness, and˜1.0 mm thickness at 100% insulation by thickness.

As demonstrated in the present Example, in some aspects of the presentdisclosure, the dielectric constant of the thermal insulation layer maybe more impactful than the loss tangent. With this, in some embodiments,thermal insulation layers with low thermal conductivity (k<0.025 W/m·K),low dielectric constants (Dk<1.5), and moderate loss tangents (Df<0.03)may present a unique advantage for thermal insulation components inmillimeter-scale wave antenna applications.

Example 2

Material attributes for constituent layers of thermal insulationcomponent designs were either measured or obtained from data sheets orliterature references. The thermal conductivity, dielectric constant andloss tangent values were obtained for: adhesive layers, thermalinsulation layers, and protective films. Unless denoted otherwise,samples were measured according to the procedures detailed for “ThermalConductivity Test Method” and “Dielectric Property Test Method” (see,supra “Test Methods”). Table 2 summarizes the properties for eachconstituent layer of the present Example. The layers of Table 2 are themeasured constituent layers that will be referenced for modeling. Ifmultiple samples of a particular constituent layer were measured, arange is shown to capture the measurement values obtained.

TABLE 2 Measured Constituent Layers Constituent Layer ConstituentMaterial Product Material Sample Type Layer code Manufacturer P/NDescription Thermal Insulation TL1 W. L. Gore & — Silica aerogel LayerAssociates, Inc. reinforced with PTFE Thermal Insulation TL2 W. L. Gore& — Silica aerogel Layer Associates, Inc. reinforced with PTFE, cladwith ePTFE membranes Thermal Insulation TL3 Sheen Electronical SY300Silica aerogel Layer Technology Co., Ltd coating reinforced with PETcarrier film Protective Film: PF1 Sidike New Materials SDK7140 PETsingle-sided Polymer Layer + Science and Technology acrylic adhesiveAdhesive Layer Co., Ltd tape Protective Film: PF2 W. L. Gore & — ePTFEFilm Polymer Layer Associates, Inc. Adhesive Layer AL1 Sidike NewMaterials SDK97C01 PET double-sided (Second Adhesive Science andTechnology acrylic adhesive Layer) Co., Ltd tape Measured AttributesProperties Loading of Thermal Dielectric Constituent Thickness AerogelConductivity, Constant, Loss Tangent, Layer code (mm) (wt %) k (W/m · K)Dk Df TL1 0.25-0.78 55 0.015-0.02 1.16-1.32  0.0095-0.0203 TL2  0.1-0.5352 0.015-0.02 1.18-1.36 0.0096-0.022 TL3 0.08-0.12 22  0.033-0.045 1.640.011 PF1 0.01  N/A 0.19^(a) 2.75 0.023 PF2 0.006 N/A 0.06  1.1-2 0.00008-0.0002 AL1 0.005-0.01  N/A 0.19^(a) 2.44 0.014 ^(a)PET andacrylic values obtained from the following literature sources:https://www.electronics-cooling.com/2001/05/the-thermal-conductivity-of-unfilled-plastics/,http://www.matweb.com/search/datasheet.aspx?MatGUID=632572aeef2a422b5ac8fbd4f1b6f77

Additionally, thermal insulation components, comprised of severalconstituent layers, were tested. Unless denoted otherwise, layers weremeasured according to the procedures detailed for “Thermal ConductivityTest Method” and “Dielectric Property Test Method.” Table 3 summarizesthe properties for the thermal insulation components. The layers ofTable 3 are the measured components that will be referenced formodeling. If multiple samples of a component were measured, a range isshown to capture the measurement values obtained

TABLE 3 Measured Thermal Insulation Components Component Insulation codeManufacturer Product P/N TC1 W. L. Gore & — Associates, Inc. TC2 W. L.Gore & — Associates, Inc. TC3 W. L. Gore & — Associates, Inc. TC4Panasonic NASBIS ® EYG- (sourced from Digi- Y0912QN6S Key ® Electronics)TC5 Panasonic NASBIS ® EYG- (sourced from Digi- Y0912QN4S Key ®Electronics) Material Description Adhesive Layer Component ThermalInsulation (Second code Layer Protective film Adhesive) TC1 Silicaaerogel reinforced ePTFE Film + PET double- with PTFE PET double- sidedacrylic sided acrylic adhesive tape adhesive tape TC2 Silica aerogelreinforced PET single-sided PET double- with PTFE, clad with acrylicadhesive sided acrylic ePTFE membranes tape adhesive tape TC3 Silicaaerogel reinforced PET single-sided PET double- with PTFE acrylicadhesive sided acrylic tape adhesive tape TC4 Silica aerogel reinforcedPET film PET double- with PET textile (no adhesive) sided acrylicadhesive tape TC5 Silica aerogel reinforced PET film PET double- withPET textile (no adhesive) sided acrylic adhesive tape MeasuredAttributes Properties Loading of Thermal Dielectric Loss ComponentAerogel Conductivity, Constant, Tangent, code (wt %) k (W/m · K) Dk DfTC1 55 0.016-0.022 1.34 0.0128 TC2 52 0.017-0.024 1.46 0.0151 TC3 550.016-0.021 1.32-1.38 0.0124-0.0170 TC4 20 0.024-0.033 1.6 0.009 TC5 480.019-0.023 1.4 0.007

Example 3

The following articles and comparative articles, which take the forms ofthermal insulation layers, thermal insulation components, andcombinations thereof, were constructed and tested. Components andconstituent layers were tested for thermal conductivity and dielectricproperties, and are described in Tables 2 and 3.

Article 1: (Article 1 is a thermal insulation layer designated asComponent G1) A thermal insulation layer comprised of silica aerogelreinforced with PTFE was created per the teachings of U.S. Pat. No.7,118,801 to Ristic-Lehmann et al. with a thickness of 0.25 mm. Theloading of the aerogel in the composite was measured to be 55 wt %,according to “Thermogravimetric Analysis Method” (see, supra, “TestMethods”). The thermal conductivity of the composite was measured to be0.017 W/m-K at 25° C. and 1 atm, when measured according to “ThermalConductivity Test Method”. The dielectric properties of the compositewere measured according to “Dielectric Property Test Method”, where thedielectric constant of the composite was measured to be 1.27 at 10 GHzand the loss tangent of the composite was measured to be 0.0164 at 10GHz.

Article 2: (Article 2 is designated as Component H2) A thermalinsulation layer comprised of silica aerogel reinforced with PTFE, withtwo ePTFE membranes bonded to both surfaces of the composite throughtemperature and pressure, was created per the teachings of U.S. Pat. No.7,118,801 to Ristic-Lehmann et al. The ePTFE membranes were created perthe teachings of U.S. Pat. No. 5,476,589 to Bacino, with both membraneshaving a mass per area of 0.5 g/m², air permeability of 3.4 Frazier, andthickness of 0.004 mm. The final thickness of the thermal insulationlayer was 0.1 mm. The loading of the aerogel in this thermal insulationlayer was measured to be 52 wt %, according to “ThermogravimetricAnalysis Method”. The thermal conductivity of the thermal insulationlayer was measured to be 0.018 W/m-K at 25° C. and 1 atm, when measuredaccording to “Thermal Conductivity Test Method”. The dielectricproperties of the thermal insulation layer were measured according to“Dielectric Property Test Method”, where the dielectric constant wasmeasured to be 1.32 at 10 GHz and the loss tangent was measured to be0.0185 at 10 GHz.

Article 3: (A thermal insulation component designated as Component A1)The thermal insulation layer from Article 1 was used to construct athermal insulation component with an adhesive layer and a protectivefilm consisting of ePTFE. A 0.006 mm thick densified ePTFE film wascreated per the teachings of U.S. Pat. No. 7,521,010 to Kennedy et al. APET double-sided acrylic adhesive tape of 0.005 mm thickness (partnumber 82600 Electronic Double Sided Tapes from 3M) was adhered to the0.006 mm thick densified ePTFE film to create a protective film. Thisprotective film was adhered to the 0.25 mm thick thermal insulationlayer of Article 1 using light pressure applied with a hand roller. APET double-sided acrylic adhesive tape of 0.01 mm thickness (part numberSDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) wasadhered to the thermal insulation layer on the side facing away from theprotective film. The adhesive was applied with light pressure using ahand roller. The thermal insulation component, consisting of a thermalinsulation layer, a protective film, and an adhesive layer, had athickness of 0.271 mm. The thermal conductivity of the thermalinsulation component was measured to be 0.018 W/m-K at 25° C. and 1 atm,when measured according to “Thermal Conductivity Test Method”. Thedielectric properties of the thermal insulation component were measuredaccording to “Dielectric Property Test Method”, where the dielectricconstant was measured to be 1.34 at 10 GHz and the loss tangent wasmeasured to be 0.0128 at 10 GHz.

Article 4: (The thermal insulation component of Article 4 is designatedas Components B1 and B2) The thermal insulation layer from Article 2 wasused to construct a thermal insulation component with an adhesive layerand a protective film consisting of PET. A 0.01 mm thick PETsingle-sided acrylic adhesive (part number SDK7140 from Sidike NewMaterials Science and Technology Co., Ltd.) was used as a protectivefilm and was adhered to the 0.1 mm thick thermal insulation layer fromArticle 2 using light pressure applied with a hand roller. A PETdouble-sided acrylic adhesive tape of 0.01 mm thickness (part numberSDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) wasadhered to the thermal insulation layer on the side facing away from theprotective film. The adhesive was applied with light pressure using ahand roller. The thermal insulation component, consisting of a thermalinsulation layer, a protective film, and an adhesive layer, had athickness of 0.12 mm. The thermal conductivity of the thermal insulationcomponent was measured to be 0.021 W/m-K at 25° C. and 1 atm, whenmeasured according to “Thermal Conductivity Test Method”. The dielectricproperties of the thermal insulation component was measured according to“Dielectric Property Test Method”, where the dielectric constant wasmeasured to be 1.52 at 10 GHz and the loss tangent was measured to be0.0149 at 10 GHz.

Article 5: (The thermal insulation component of Article 5 is designatedas Components C1 and C2) The thermal insulation layer from Article 1 wasused to construct a thermal insulation component with an adhesive layerand a protective film consisting of PET. A 0.01 mm thick PETsingle-sided acrylic adhesive (part number SDK7140 from Sidike NewMaterials Science and Technology Co., Ltd.) was used as a protectivefilm and was adhered to the 0.25 mm thick thermal insulation layer fromArticle 1 using light pressure applied with a hand roller. A PETdouble-sided acrylic adhesive tape of 0.01 mm thickness (part numberSDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) wasadhered to the thermal insulation layer on the side facing away from theprotective film. The adhesive was applied with light pressure using ahand roller. The thermal insulation component, consisting of a thermalinsulation layer, a protective film, and an adhesive layer, had athickness of 0.27 mm. The thermal conductivity of the thermal insulationcomponent was measured to be 0.0185 W/m-K at 25° C. and 1 atm, whenmeasured according to “Thermal Conductivity Test Method”. The dielectricproperties of the thermal insulation component were measured accordingto “Dielectric Property Test Method”, where the dielectric constant wasmeasured to be 1.38 at 10 GHz and the loss tangent was measured to be0.017 at 10 GHz.

Article 6: (Th thermal insulation component is designated as ComponentsD1 and D2) A thermal insulation layer comprised of silica aerogelreinforced with PTFE was created per the teachings of U.S. Pat. No.7,118,801 to Ristic-Lehmann et al. with a thickness of 0.35 mm. Theloading of the aerogel in the composite was measured to be 55 wt %,according to “Thermogravimetric Analysis Method”. The thermal insulationlayer was used to construct a thermal insulation component with anadhesive layer and a protective film consisting of PET.

A 0.01 mm thick PET single-sided acrylic adhesive (part number SDK7140from Sidike New Materials Science and Technology Co., Ltd.) was used asa protective film and was adhered to the 0.35 mm thick thermalinsulation layer using light pressure applied with a hand roller.

A PET double-sided acrylic adhesive tape of 0.01 mm thickness (partnumber SDK97C01 from Sidike New Materials Science and Technology Co.,Ltd.) was adhered to the thermal insulation layer on the side facingaway from the protective film. The adhesive was applied with lightpressure using a hand roller.

The thermal insulation component, consisting of a thermal insulationlayer, a protective film, and an adhesive layer, had a thickness of 0.37mm. The thermal conductivity of the thermal insulation component wasmeasured to be 0.0167 W/m-K at 25° C. and 1 atm, when measured accordingto “Thermal Conductivity Test Method”. The dielectric properties of thethermal insulation component were measured according to “DielectricProperty Test Method”, where the dielectric constant was measured to be1.32 at 10 GHz and the loss tangent was measured to be 0.0124 at 10 GHz.

Article 7: (The thermal insulation component of Article 7 is designatedas Component F1) A thermal insulation component produced by Panasonicconsisting of silica aerogel reinforced by a PET non-woven textile (partnumber NASBIS® EYG-Y0912QN4S from Digi-Key® Electronics) was sourced.This part number is comprised of a 0.48 mm thick reinforced thermalinsulation layer, 0.01 mm thick PET protective film (containing noadhesive) on one side of the thermal insulation layer, and a 0.01 mmthick double-sided acrylic adhesive on the side of the thermalinsulation layer facing away from the protective film. The totalthickness of the thermal insulation component is measured to be 0.5 mm.The loading of the aerogel in this thermal insulation component wasmeasured to be 47.8 wt %, according to “Thermogravimetric AnalysisMethod”. The thermal conductivity of the thermal insulation componentwas measured to be 0.020 W/m-K at 25° C. and 1 atm, when measuredaccording to “Thermal Conductivity Test Method”. The dielectricproperties of the thermal insulation component were measured accordingto “Dielectric Property Test Method”, where the dielectric constant wasmeasured to be 1.4 at 10 GHz and the loss tangent was measured to be0.007 at 10 GHz.

Comparative Example 1

Comparative Article 1: (The thermal insulation component of ComparativeArticle 1 is designated as Component E1) A thermal insulation componentproduced by Panasonic consisting of silica aerogel reinforced by a PETnon-woven textile (part number NASBIS® EYG-Y0912QN6S from Digi-Key®Electronics) was sourced. This part number is comprised of the 0.1 mmthick reinforced thermal insulation layer, 0.01 mm thick PET protectivefilm (containing no adhesive) on one side of the thermal insulationlayer, and a 0.01 mm thick double-sided acrylic adhesive on the side ofthe thermal insulation layer facing away from the protective film. Thetotal thickness of the thermal insulation component is measured to be0.12 mm. The loading of the aerogel in this thermal insulation componentwas measured to be 20.1 wt %, according to “Thermogravimetric AnalysisMethod” (see, supra, “Test Methods”). The thermal conductivity of thethermal insulation component was measured to be 0.028 W/m-K at 25° C.and 1 atm, when measured according to “Thermal Conductivity TestMethod”. The dielectric properties of the thermal insulation componentwere measured according to “Dielectric Property Test Method”, where thedielectric constant was measured to be 1.6 at 10 GHz and the losstangent was measured to be 0.009 at 10 GHz

Comparative Article 2: (This thermal insulation layer is designated asComponent I1) A thermal insulation layer produced by Shenzhen ShenEnDianzi Keji (“Sheen Electronics”) consisting of a silica aerogelreinforced with a PET carrier film (part number SY300N) was sourced.This part number is comprised of a 0.03 mm PET carrier film with a 0.075mm coating of aerogel on one side of the PET carrier film. The thicknessof the thermal insulation layer was measured to be 0.105 mm. The loadingof the aerogel in this thermal insulation layer was measured to be 22.5wt %, according to “Thermogravimetric Analysis Method”. The thermalconductivity of the thermal insulation layer was measured to be 0.033W/m-K at 25° C. and 1 atm, when measured according to “ThermalConductivity Test Method”. The dielectric properties of the thermalinsulation layer were measured according to “Dielectric Property TestMethod”, where the dielectric constant was measured to be 1.64 at 10 GHzand the loss tangent was measured to be 0.011 at 10 GHz.

Example 4

TABLE 4 Model Inputs - Measured Components Example Code ComponentConstruction Measured Adhesive Components Thermal Insulation LayerProtective Film Layer A1* Silica aerogel reinforced ePTFE Film + Acrylicwith PTFE Adhesive Adhesive B1* Silica aerogel reinforced PET Film +Acrylic with PTFE, clad with ePTFE Adhesive Adhesive membranes C1*Silica aerogel reinforced PET Film + Acrylic with PTFE Adhesive AdhesiveD1* Silica aerogel reinforced PET Film + Acrylic with PTFE AdhesiveAdhesive E1* Silica aerogel reinforced PET Film Acrylic with PET TextileAdhesive F1* Silica aerogel reinforced PET Film Acrylic with PET TextileAdhesive Thickness Example Total Code Component % Insulation LayerProperties Measured Thickness % Protective Film Component ComponentComponent k Components (mm) % Adhesive Layer Dk Df (W/m · K) A1* 0.27192.2 1.34 0.0128 0.0184 3.9 3.9 B1* 0.12 83.4 1.52 0.0149 0.0214 8.3 8.3C1* 0.27 92.6 1.38 0.017 0.0185 3.7 3.7 D1* 0.37 94.6 1.32 0.0124 0.0182.7 2.7 E1* 0.12 83.4 1.6 0.009 0.028 8.3 8.3 F1* 0.5 96 1.4 0.007 0.022 2

The thermal insulation components displayed in Table 4 were physicallyconstructed and tested per the “Thermal Conductivity Test Method” and“Dielectric Property Test Method” (see, supra, Test Methods). Themeasured parameters were input into the model shown in FIG. 9 todetermine if the components pass or fail the RF transmission lossrequirement. No thermal conductivity calculation was required sincethermal conductivity was measured on the thermal insulation components.

The constituent layers of Components B1, C1, and D1, were individuallytested per “Thermal Conductivity Test Method” and “Dielectric PropertyTest Method.” Table 5 displays Components B2, C2, and D2, which arevirtual constructions of B1, C1, and D1, respectively, by using themeasured attributes of constituent layers and principles of seriesimpedance. The measured parameters were input into the models depictedin FIGS. 8 and 9 to determine if the components: 1) pass or fail thermalconductivity and RF transmission loss requirements, and 2) match closelywith their component counterpart (B2 compared to B1, etc.). Results forcomponents A1, B1, B2, C1, C2, D1, D2, E1, and F1 are displayed in Table6.

TABLE 5 Model Inputs - Select Measured Components by Constituent LayerSample Code Thickness Virtual Component Component Construction %Composition Constructions (from Thermal Total Insulation Layer MeasuredConstituent Insulation Protective Adhesive Component Protective FilmLayers) Layer Film Layer (mm) Adhesive Layer B2 Silica aerogel PETFilm + Acrylic 0.12 83.4 reinforced with Adhesive Adhesive 8.3 PTFE,clad with 8.3 ePTFE membranes C2 Silica aerogel PET Film + Acrylic 0.2792.6 reinforced with Adhesive Adhesive 3.7 PTFE 3.7 D2 Silica aerogelPET Film + Acrylic 0.37 94.6 reinforced with Adhesive Adhesive 2.7 PTFE2.7 Sample Code Properties Virtual Component Dk Df k (W/m · K)Constructions (from Thermal Insulation Thermal Insulation ThermalInsulation Measured Constituent Layer Protective Film Layer ProtectiveFilm Layer Protective Film Layers) Adhesive Layer Adhesive LayerAdhesive Layer B2 1.32 0.0185 0.018 2.74 0.0167 0.19 2.44 0.014 0.19 C21.28 0.0176 0.017 2.74 0.0167 0.19 2.44 0.014 0.19 D2 1.23 0.0122 0.0172.74 0.0167 0.19 2.44 0.014 0.19

TABLE 6 Thermal and RF Outputs (Pass/Fail) for Components A-F Thermal RFConductivity Transmission (W/m · K) Loss (dB) Component P/F P/F P/FSample Conduc- (<0.025 @28 (<0.25 @39 (<0.25 code tivity W/m · K) GHzdB) GHz dB) A1* 0.0184 P 0.0149 P 0.0224 P B1* 0.0214 P 0.0084 P 0.0124P B2 0.0212 P 0.0098 P 0.0144 P C1* 0.0185 P 0.02 P 0.0297 P C2 0.0182 P0.0201 P 0.0299 P D1* 0.018 P 0.0205 P 0.031 P D2 0.0179 P 0.0199 P0.0298 P E1* 0.028 F 0.0063 P 0.0099 P F1* 0.02 P 0.0266 P 0.0436 P

All tested sample constructions pass the requirements except forComponent E1. Component E1 failed the thermal conductivity specificationof <0.025 W/m·K at 25° C. and 1 atm. As was shown in Table 2, thisthermal component has an aerogel loading of 20 wt %, illustrating that,in some embodiments, a low loading of aerogel content in the thermalinsulation component will result in higher than desired thermalconductivity. In the tested components with a low loading of aerogel,the resulting component conductivity is greater than that of air,leading to an ineffective thermal barrier as compared to air. The othercomponents that pass the thermal conductivity requirement have aerogelloadings of 48-55 wt %, demonstrating that, in some embodiments, thedesign of the thermal insulation layer is critical to ensuring a thermalconductivity below that of air.

The thermal conductivity and RF transmission loss results for ComponentsB2, C2, and D2, matched very closely to their counterparts B1, C1, andD1, respectively. These results validate the approach of using virtualconstructions of thermal insulation components from constituent layerswith given properties. In some of the following examples, this approachwill be used to build constructions that are thicker than physicalsamples tested in the “Thermal Conductivity Test Method” and “DielectricProperty Test Method.”

Example 5

TABLE 7 Model Inputs - Virtual Constructions for Two-Layer ComponentsSample Code Virtual Constructions for Component Construction Two-LayerComponents Thermal Insulation Layer Protective Film G Silica aerogelreinforced None with PTFE H Silica aerogel reinforced None with PTFE,clad with ePTFE membranes I Silica aerogel coating None reinforced withPET carrier film J Silica aerogel reinforced ePTFE Film with PTFE KSilica aerogel reinforced PET Film with PTFE, clad with ePTFE membranesProperties Sample Code Dk Df k (W/m · K) Virtual Constructions ThermalInsulation Thermal Insulation Thermal Insulation for Two-Layer LayerLayer Layer Components Protective Film Protective Film Protective Film G1.27 0.0164 0.017 N/A N/A N/A H 1.32 0.0185 0.018 N/A N/A N/A I 1.640.011 0.033 N/A N/A N/A J 1.32 0.0203 0.015 1.4  0.0001 0.06 K 1.360.022 0.02 2.75 0.023 0.19

Table 7 describes Components G, H, I, J, and K which are virtualcomponent constructions built from constituent layers with measuredproperties, independent of thickness. All components comprise a thermalinsulation layer, and Components J and K additionally comprise aprotective film. Additional adhesive layers are omitted in order tosimplify the following samples.

TABLE 8 Thermal and RF Outputs (Pass/Fail) for Components G-K ThicknessInputs Thermal Conductivity (W/m · K) Total Component % % ProtectiveComponent P/F (<0.025 Sample Thickness (mm) Insulation Film ConductivityW/m · K) G1* 0.25 100 0 0.017 P G2 2 100 0 0.017 P H1 0.03 100 0 0.018 PH2* 0.1 100 0 0.018 P H3 2 100 0 0.018 P I1* 0.12 100 0 0.033 F I2 2 1000 0.033 F J1 0.5 50 50 0.024 P J2 2 50 50 0.024 P J3 2 80 20 0.0176 P J42 98 2 0.0152 P K1 0.5 50 50 0.0362 F K2 1 50 50 0.0362 F K3 1 80 200.0244 P K4 2 80 20 0.0244 P K5 1 98 2 0.0204 P K6 2 98 2 0.0204 P RFTransmission Loss (dB) P/F P/F Sample @28 GHz (<0.25 dB) @39 GHz (<0.25dB) G1* 0.0149 P 0.0216 P G2 0.1536 P 0.1856 P H1 0.0019 P 0.0027 P H2*0.0066 P 0.0094 P H3 0.1889 P 0.2223 P I1* 0.0077 P 0.0119 P I2 0.3323 F0.2926 F J1 0.0286 P 0.045 P J2 0.158 P 0.172 P J3 0.18 P 0.2037 P J40.1973 P 0.2327 P K1 0.1549 P 0.2569 F K2 0.4358 F 0.6631 F K3 0.2077 P0.3064 F K4 0.4071 F 0.4295 F K5 0.1204 P 0.1744 P K6 0.2368 P 0.263 F

Sample components G1, G2, H1, H2, and H3 exhibit aerogel loadings of52-55 wt %, yielding k≤0.02 W/m·K, which passes the thermal conductivitycriteria (k<0.025 W/m·K). The low Dk (<1.5) and moderate Df (<0.03& >0.01) of these components enable RF transmission loss <0.25 dB at 28and 39 GHz, which passes for the RF transmission loss criteria for allexamples constructions up to 2 mm.

Components I1 and I2 exhibit aerogel loadings of 22.5 wt %, yieldingk>0.025, which fails the thermal conductivity criteria (k<0.025 W/m·K).The moderate Dk (<2.0) and moderate Df (<0.03) of these componentsenable RF transmission loss <0.25 dB at 28 and 39 GHz for relativelythin samples (<˜0.5 mm), and RF transmission loss >0.25 dB at 28 and 39GHz for thicker samples (>˜0.5 mm) up to 2 mm. Therefore, Example I1(0.12 mm) passes the RF transmission loss criteria and I2 (2 mm) failsthe RF transmission loss criteria.

Components J and K are constructed with similar thermal insulationlayers and different protective films. While PET is a commodity and PETprotective films may have advantages in cost, ePTFE protective filmshave relative advantages in low k (0.06 W/m·K), low Dk (<1.5), and verylow Df (<0.001). Comparatively, the PET protective film has moderate k(<0.4 W/m·K), moderately high Dk (<3.0), and moderate Df (<0.03).

The thermal insulation layers for Components J1, J2, J3, and J4 exhibitaerogel loadings of ˜55 wt %. When bonded to an ePTFE protective film,the thermal conductivity of the thermal insulation component is <0.025W/m·K for all example constructions ≥50% insulation by thickness. Thesecomponents enable RF transmission loss <0.25 dB at 28 and 39 GHz, whichpasses for the RF transmission loss criteria for all examplesconstructions up to 2 mm.

The thermal insulation layers for Components K1, K2, K3, K4, K5, and K6exhibit aerogel loadings of 52 wt %. When bonded to a PET protectivefilm, the thermal conductivity of thermal insulation component is <0.025W/m·K for all example constructions ≥80% insulation by thickness. Thesecomponents enable RF transmission loss <0.25 dB at 28 and 39 GHz atspecific combinations of component thickness and % insulation bythickness. It can also be noted that some example constructions may meetthe RF transmission loss criteria at 28 GHz, but not at 39 GHz, such asComponents K1, K3, and K6. The design space for Thermal InsulationComponent K is shown in the graph of FIG. 11A, with FIG. 11B being a keyfor FIG. 11A. Sample components K1, K2, K3, K4, K5, and K6 are tagged onthe graph for reference of passing and failing samples by designrequirement (Table 8). Components B, C, and D are shown in FIG. 11A forreference since the constituent materials and properties are similar tothat of Component K.

Example 6

TABLE 9 Model Inputs - Virtual Component Constructions ExhibitingDielectric Limits Sample Code Virtual Constructions for ComponentsExhibiting Component Construction Dielectric Limits Thermal InsulationLayer Protective Film L Reinforced Aerogel ePTFE Film M ReinforcedAerogel ePTFE Film Properties Sample Code Dk Df k (W/m · K) VirtualConstructions for Thermal Insulation Thermal Insulation ThermalInsulation Components Exhibiting Layer Layer Layer Dielectric LimitsProtective Film Protective Film Protective Film L 4 0.01 0.017 1.40.0001 0.06 M 1.2 0.1 0.017 1.4 0.0001 0.06

Table 9 displays two thermal insulation components that test thedielectric limits of the thermal insulation layer on the thermalinsulation component design space. ePTFE is the protective film in thisexercise due to its low dielectric properties. The thermal insulationlayer of Component L was chosen to exhibit an upper limit of Dk (4.0)and the thermal insulation layer of Component M was chosen to exhibit anupper limit of Df (0.1).

TABLE 10 Thermal and RF Outputs (Pass/Fail) for Components L-M ThicknessInputs Thermal Conductivity Total (W/m · K) Component % P/F Thickness %Protective Component (<0.025 Sample (mm) Insulation Film ConductivityW/m · K) L1 0.04 80 20 0.0198 P L2 0.23 80 20 0.0198 P M1 0.04 80 200.0198 P M2 0.7 80 20 0.0198 P RF Transmission Loss (dB) P/F P/F Sample@ 28 GHz (<0.25 dB) @ 39 GHz (<0.25 dB) L1 0.0069 P 0.0117 P L2 0.136 P0.2467 P M1 0.0098 P 0.0137 P M2 0.1769 P 0.2465 P

Four samples were tested using the Material Properties from Table 9.Results are displayed in Table 10. Samples L1 and M1 show that thinversions of these components are suitable in the design space. SamplesL2 and M2 were constructed to find the max thickness (80% insulation bythickness) such that the component passes all criteria for Thermal andRF. For L2 and M2, the component thickness limits were found to be 0.23mm and 0.7 mm, respectively. These results exemplify the tradeoffsbetween thickness and dielectric properties of the thermal insulationlayer. The results also demonstrate that the dielectric constant of thethermal insulation layer may be more sensitive to changes in thicknessthan the loss tangent of the thermal insulation layer.

All prior patents, publications, and test methods referenced herein areincorporated by reference in their entireties. Variations, modificationsand alterations to embodiments of the present disclosure described abovewill make themselves apparent to those skilled in the art. All suchvariations, modifications, alterations and the like are intended to fallwithin the spirit and scope of the present disclosure, limited solely bythe appended claims.

While several embodiments of the present disclosure have been described,it is understood that these embodiments are illustrative only, and notrestrictive, and that many modifications may become apparent to those ofordinary skill in the art. For example, all dimensions discussed hereinare provided as examples only, and are intended to be illustrative andnot restrictive.

Any feature or element that is positively identified in this descriptionmay also be specifically excluded as a feature or element of anembodiment of the present as defined in the claims.

The disclosure described herein may be practiced in the absence of anyelement or elements, limitation or limitations, which is notspecifically disclosed herein. Thus, for example, in each instanceherein, any of the terms “comprising,” “consisting essentially of” and“consisting of” may be replaced with either of the other two terms,without altering their respective meanings as defined herein. The termsand expressions which have been employed are used as terms ofdescription and not of limitation, and there is no intention in the useof such terms and expressions of excluding any equivalents of thefeatures shown and described or portions thereof, but it is recognizedthat various modifications are possible within the scope of thedisclosure.

1. An assembly comprising: at least one antenna, wherein the at leastone antenna is configured to transmit a field of radiofrequency (RF)communication at an operating frequency ranging from 6 GHz to 100 GHz;and a thermal insulation component, wherein the thermal insulationcomponent is disposed within the field of RF communication, and whereinthe thermal insulation component has a thermal conductivity of 0.0025W/m·K to 0.025 W/m·K at 25° C. and 1 atm.
 2. The assembly of claim 1,wherein the thermal insulation component comprises a thermal insulationlayer and a protective film.
 3. The assembly of claim 2, wherein thethermal insulation component consists of a thermal insulation layer anda protective film.
 4. (canceled)
 5. The assembly of claim 1, wherein theprotective film further comprises a polymer layer and an adhesive layer,and wherein the adhesive layer is disposed between the thermalinsulation layer and the polymer layer.
 6. The assembly of claim 1,wherein the thermal insulation component comprises a thermal insulationlayer and an adhesive layer, wherein the adhesive layer is disposedbetween the thermal insulation layer and the at least one antenna. 7.The assembly of claim 2, wherein the thermal insulation componentfurther comprises an adhesive layer, wherein the thermal insulationlayer is disposed between the protective film and the adhesive layer,and wherein the adhesive layer is disposed between the thermalinsulation layer and the at least one antenna.
 8. (canceled) 9.(canceled)
 10. The assembly of claim 4, wherein a combined thickness ofthe protective film and the second adhesive layer does not exceed athickness of the thermal insulation layer.
 11. (canceled)
 12. (canceled)13. The assembly of claim 1, wherein the thermal insulation layer, thethermal insulation component, or any combination thereof comprises anaerogel.
 14. The assembly of claim 13, wherein the thermal insulationlayer, the thermal insulation component, or any combination thereofcomprises the aerogel in an amount of at least 30 wt % based on a totalweight of the thermal insulation layer, the thermal insulationcomponent, or any combination thereof.
 15. The assembly of claim 13,wherein the thermal insulation layer, the thermal insulation component,or any combination thereof, further comprises a fluoropolymer. 16.(canceled)
 17. The assembly of claim 13, wherein the aerogel is aceramic aerogel, a polymer aerogel, or any combination thereof. 18.-20.(canceled)
 21. The assembly of claim 13, wherein the reinforced aerogelis a Polyethylene terephthalate (PET) reinforced aerogel, apolytetrafluoroethylene (PTFE) reinforced aerogel, or any combinationthereof.
 22. (canceled)
 23. (canceled)
 24. The assembly of claim 1,wherein the at least one antenna is in the form of an antenna array,wherein the antenna array comprises a plurality of antennas, whereineach antenna is configured to transmit the field of RF communication atthe operating frequency ranging from 6 GHz to 100 GHz.
 25. (canceled)26. The assembly of claim 2, wherein the thermal insulation layer has athermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C.and 1 atm.
 27. The assembly of claim 1, wherein the thermal insulationcomponent, the thermal insulation layer, or any combination thereof hasa dielectric constant ranging from 1.05 to 4 measured in accordance withIEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a Split PostDielectric Resonator (SPDR).
 28. The assembly of claim 1, wherein thethermal insulation component, the thermal insulation layer, or anycombination thereof has a loss tangent ranging from 0.00001 to 0.1measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHzusing a Split Post Dielectric Resonator (SPDR).
 29. (canceled)
 30. Theassembly of claim 1, wherein the assembly is within an enclosure, andwherein the assembly further comprises an adhesive layer between thethermal insulation component and the enclosure.
 31. (canceled) 32.(canceled)
 33. The assembly of claim 24, wherein the antenna arraycomprises a plurality of planes, and wherein the thermal insulationcomponent is in contact with at least two planes of the plurality ofplanes.
 34. (canceled)
 35. The assembly of claim 1, wherein the assemblyfurther comprises a power amplifier, and wherein the power amplifier isin physical contact with the at least one antenna.
 36. The assembly ofclaim 35, wherein the power amplifier is bonded to the at least oneantenna.
 37. (canceled)
 38. (canceled)
 39. The assembly of claim 21,wherein the PTFE reinforced aerogel is a PTFE reinforced aerogel in aclad configuration, wherein the clad configuration comprises a pluralityof ePTFE layers, wherein each of the plurality of ePTFE layers is bondedto a surface of the thermal insulation layer.
 40. The assembly of claim14, wherein the thermal insulation layer, the thermal insulationcomponent, or any combination thereof comprises the aerogel in an amountof 30 wt % to 95 wt % based on a total weight of the thermal insulationlayer, the thermal insulation component, or any combination thereof. 41.(canceled)
 42. A method comprising: obtaining at least one antenna;wherein the at least one antenna of is configured to transmit a field ofradiofrequency (RF) communication at an operating frequency ranging from6 GHz to 100 GHz; and placing a thermal insulation component on at leastone surface of the at least one antenna, so as to form an assembly;wherein placing the thermal insulation component on at least one surfaceof the antenna array disposes the thermal insulation component withinthe field of RF communication, and wherein the thermal insulationcomponent has a thermal conductivity of less than 0.025 W/m·K at 25° C.and 1 atm.
 43. The method of claim 42, further comprising forming thethermal insulation component from a thermal insulation layer and aprotective film.
 44. The method of claim 43, further comprising formingthe protective film from a polymer layer and an adhesive layer. 45.-48.(canceled)
 49. The method of claim 42, wherein the at least one antennais in the form of an antenna array, wherein the antenna array comprisesa plurality of antennas, wherein the antenna array comprises a pluralityof planes, and wherein the method comprises placing the thermalinsulation component on at least two planes of the plurality of planes.50. (canceled)
 51. (canceled)
 52. An assembly comprising: at least oneantenna, wherein the at least one antenna is configured to transmit afield of radiofrequency (RF) communication at an operating frequencyranging from 6 GHz to 100 GHz; and a thermal insulation component,wherein the thermal insulation component is disposed within the field ofRF communication, wherein the thermal insulation component has athickness of 0.03 mm to 2 mm, and wherein the thermal insulationcomponent comprises an aerogel in an amount of 30 wt % to 95 wt % basedon a total weight of the thermal insulation component.
 53. The assemblyof claim 52, wherein the thermal insulation component has a thermalconductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1atm.
 54. An assembly comprising: an antenna array, wherein the antennaarray is configured to transmit a field of radiofrequency (RF)communication at an operating frequency ranging from 6 GHz to 100 GHz;and a thermal insulation component, wherein the thermal insulationcomponent is disposed within the field of RF communication, and whereinthe thermal insulation component comprises: a thermal insulation layer;wherein the thermal insulation layer defines 50% to 99% of a totalthickness of the thermal insulation component; and a protective film,wherein the protective film comprises: a polymer layer; and an adhesivelayer, wherein the adhesive layer is disposed between the thermalinsulation layer and the polymer layer.
 55. The assembly of claim 54,wherein the at least one thermal insulation layer has a thermalconductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1atm.